• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Exposure of fine patterns on a photoresist is carried out by controlling the humidity and temperature of a gas to be supplied to an exposure apparatus separate from the ambient atmosphere. Temperature of the atmosphere at least in the vicinity of a photoresist is controlled in a predetermined range and air or gas to be supplied to the exposure space is humidified to a desired degree. Water content in the photoresist is kept uniform and constant by the specially controlled atmosphere and enables uniform pattern width of the exposed fine pattern all over the photoresist surface.
    公开号:SU1238274A1
    申请号:SU823431330
    申请日:1982-04-23
    公开日:1986-06-15
    发明作者:Дитц Гудрун；Гертнер Вальтер；Куазуми Ясухиро；Речке Вольфганг；Торисава Суачи
    申请人:Феб Карл Цайсс Йена (Инопредприятие)；
    IPC主号:
    专利说明:

    1238274
    Features and variants of its implementation of the description of the invention. 2 sec. shown in drawings in f-crystals, 9 ill.
    .
    The invention relates to a method and apparatus for exposing a photoresist in the manufacture of semiconductor; details and can be used to increase the reproducibility and local uniformity of photochemical transformation processes in photoresist.
    The purpose of the invention is to improve the uniformity of the exposure, due to the fact that the optical transfer of the image of the original to the surface of the part is carried out by controlling the humidity and temperature of the gases.
    FIG. shows the device, a general view; figure 2 - humidifier, incision; figure 3-7 - graphs of the measurement results of sensitivity and width of structural lines; on Fig and 9 is a schematic depiction of other variants of the device.
    The device for exposure contains a two-coordinate table 1, on which a product (silicon wafer) 2 is installed, covered with a layer of photoresist 3, a tube 4 is mounted above the table 1 with a lens 5, above which is placed a mask template 6 on which the image sample is located. The lens 5 is surrounded by a housing 7 fixed to the tube 4 and has an inlet 8 and an outlet 9 of the air outlet. The inlet 8 in the pszhoschi pipe 10 is connected to a source 11 of gaseous, nitrogen (N). The Tpiy6onpovod system contains a reducing valve 12, a prefilter 13, a first heat exchanger 14, a second reducing valve 15, a humidifier 16, a fine filter 17, a second heat exchanger 18, and a pneumatic focusing device 19. A pneumatic focusing device 19 contains a differential pressure element 20, which compares the gas pressure (N) in the housing 7 with the reference pressure. The focusing device 19 is equipped with
    and 2 .
    a mechanism 21 that controls the vertical movement of the tube 4. The humidifier 16 has a porous glass layer 22 that permits gases and
    a fluid that is installed near the bottom of the vessel 23 and is closed by the stopper 24. The humidifier is provided with a tube 25 passing through the glass layer 22, and. a discharge tube 26 connected to
    the upper part of the vessel 23. The vessel 23 is filled with deionized water 27, the level of which is above the porous glass layer 22, but below the discharge tube 26. The gas (Nj) through:
     25 passes into the humidifier 16, flows through the water and the porous glass layer to the upper part of the vessel 23 and enters the discharge pipe 26. The passage through the water, the gas is dampened. The moistened gas is freed from droplets, the passage through the precipitator 28 of the coil 29.
    The exposure method is as follows.
    The gas source 11 (N) supplies it with a relative humidity of 5% and at a pressure of several atmospheres. The gas pressure in the first reduction valve 12 decreases to 0, 15 pcs. AT
    Pre-filter 13 removes gas from contamination; in the first heat exchanger 14, it is preheated to a temperature of 20 ° C, which is lower than the temperature in the space between the lens 5 and photoresist 3. Then the gas pressure in the second reduction valve 15 decreases to 0.1 MPa, and the gas enters the humidifier 16. After that, the gas
    is filtered through a fine filter 17 and guided to a second heat exchanger 18, where its temperature is compared with the temperature in the space between the lens 5 and the photoresist 3 and kept constant. with an accuracy of i0.1 ° C. If, for example, the temperature is and there is an atmospheric pressure of 760 mm Hg.
    then the relative humidity that is maintained in the gas is about 35%. The moistened and tempered gas is supplied to a pneumatic focusing mechanism 19, which operates at an average measuring pressure of OO, OZMPa. From the focusing mechanism 19, gas is fed through inlet 8 into the housing 7 into the space between the lens 5 and the photoresist 3. Under these conditions, the vertical the position of the lens is controlled by a pneumatic focusing mechanism 19,
    According to FIG. 8, the device comprises an air conditioner 30 ,. which supports; the temperature in the chamber is constant at a predetermined level. The air conditioner 30 consists of an air inlet 31 for the air, an external air inlet 32, an air blower 33, a temperature control system 34 and an air filter 35. The operating mechanism 36 is an optical system that has a carrier plate 37, a two-coordinate table 38, which is fixed on the plate, the source 39 of light, the tube 40, the lens 41, the mask template 42. On the table 43 fixed product 44, covered with photo resist 45. On the tube 40 fixed case 46, which cover the lens 41 and product 44 and through, humidifier 47 and pipe 48 connected to the air line (not shown).
    Figure 9 shows an example of an exposure of the exposure device according to the method of contact and close printing.
    Plate - product 49 with photoresist 50 is mounted on table 51. Using a lifting device 52, table 51 can be moved up or down. In the same plane as the two-coordinate table 51, a table 53 with inclined nozzles 54 and an aperture 55 is installed. The device also includes a housing 56 with an opening 57 in which the mask 58 is installed. The exposure device 59 optically transfers the image of the mask 58 to the plate 49 with photoresist. In order to supply gas, the housing 56 and the transport device 60 are connected to gas source 64 via pipelines 61, 62 and 63. In line 62, pressure regulator 65 is connected in series with humidifier 66, fine filter 67, regulator 68 by order 5. About 12382744
    The pipeline 62 has a valve 69 and a pressure switch 70, and a pipe 63 has a valve 71 and a pressure relay 72.
    The device works as follows.
    Air from a gas supply unit source with a relative humidity of 10% or less and purified from dust through conduit 61 is supplied to humidifier 66 and regulated to a pressure of 0.15 MPa. Specific humidity and temperature are controlled by humidifier 66. Fine filter 67 removes contaminants and temperature controller 68 controls temperature to photoresist 50 temperature. Valve 69 adjusts compressed air flow from nozzles 54. Pipe 63 delivers moist and temperature adjusted air through the valve 71 into the housing 56.
    权利要求:
    Claims (4)
    [1]
    1. A method of exposing a photoresist, including optical transfer of the image of the original to the surface of the part covered with photoresist, in a gas environment, characterized in that, with a chain of exposure uniformity, the optical transfer of the image of the original to the surface of the part covered with photoresist is carried out with gas humidity adjustments in the range of 10-40% relative humidity, and the humidity of the supplied gas is maintained on the entire surface of the irradiated portion of the photoresist for a period of time, exposed to light .
    [2]
    2. The method according to claim 1, in which, in order to maintain a certain value of the relative humidity of the supplied gases, the optical transfer of the image of the original to the surface of the part coated with photoresist is carried out at the temperature of the gases 10-40 C.
    [3]
    3. A device for exposing a photoresist, containing a table for the product, an optical system for creating an image of the original, connected to a gas supply unit, characterized in that in order to improve the quality of the product by creating a space with a certain humidity in the immediate vicinity of the photoresist layer, a humidity torus with a temperature regulator, and the gas supply unit is equipped with a pneumatic focusing
    a mechanism connected to the humidity controller and made in the form of nozzles aimed at the surface of the product table.
    [4]
    4. Pop-up device, which differs from the fact that the body of the gas supply unit is complete: the possibility of covering the lens or the working surface of the table for the product.
    Priority for paragraphs and m:
    09/30/81 on Clauses I and 2, except for the signs from Clause 1: the moisture content of the supplied gas is maintained on the entire surface of the irradiated area of the photoresist during the time of exposure to light;
    24.0А.81 on paragraphs 3 and 4 and the specified sign from Q.1.
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    Editor M.Kelemes Order 3307/59
    9
    Compiled by V.Titov;
    Tehred M. Hodanpich Proofreader L. Patay
    Circulation 765 Subscription
    VNIIPI USSR State Committee
    for inventions and discoveries P3035, Moscow, Zh-35, Raushsk nab., 4/5
    Production and printing company, Uzhgorod, st. Project, 4
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    同族专利:
    公开号 | 公开日
    GB2100453A|1982-12-22|
    FR2504696B1|1985-11-22|
    KR840000074A|1984-01-30|
    JPS57177144A|1982-10-30|
    DD160756A3|1984-02-29|
    FR2504696A1|1982-10-29|
    DE3214325A1|1983-01-27|
    IT8267548D0|1982-04-26|
    CH651423A5|1985-09-13|
    NL8201726A|1982-11-16|
    KR860000158B1|1986-02-27|
    US4704348A|1987-11-03|
    GB2100453B|1985-03-20|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DD81229475A|DD160756A3|1981-04-24|1981-04-24|ARRANGEMENT FOR IMPROVING PHOTOCHEMICAL IMPLEMENTATION PROCESSES IN PHOTORESIS LAYERS|
    JP56154059A|JPS57177144A|1981-04-24|1981-09-30|Method and device for exposure|
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